GLASS AND CERAMIC
MICROMACHINING SOLUTIONS The applications on this type of materials are very difficult, due to their mechanical and thermal characteristics. The high fragility and insulating properties make laser processing a challenging process. The use of ultrashort pulse lasers generates clean, burr-free paths and eliminates the thermal stresses induced in the substrate avoiding fractures and consequent waste.
The most common processes are marking, cutting, drilling even with diameters less than 5µm or scribing especially in the Electronics sector and in the rapidly growing universe of the Green Economy.
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